Mechanic AD-223 Soldering Flux Paste Jar (100G)

Features:

Play in the welding process: remove oxides and reduce the surface tension of the material to be welded two main effects paste chemicals.

U.S. AM-TECH developed two ways to use the phone PCB, BGA and PGA SMD Rework help paste, which is used in low ionic activator system, run tin speed, low level of smoke residue after curing of the surface insulation resistance value is very high, so very small electrical interference for mobile phones and other communication products.

MECHANIC AD-233 as a leave-in help paste residue color is very light, very high SIR value, recommended for BGA, CSP ball array solder joint repair ball.

Mechanic AD-223-UV flux advanced SMT solder products

►Mechanic AD-223  solder paste is a high viscosity no-clean flux, help to repair the circuit boards and protect the electronic components

►It can be used for PCB, SMD and be used for soldering of computer and phone chips

►It is the mixture of high-quality alloyed powder and resinous pasty flux, it can avoid the residue, so you are easy to clean the board

► Excellent capacity of solder-stickiness

► 100% brand new and high quality Excellent capacity of solder-stickiness

► Type : RMA-223-UV 18gm Welding Flux Paste

► Excellent Anti-wet Capacity

► Widely used on BGA, PGA, CSP packages and Flip Chip Operation

► No-clean and Lead free for Environmental protection

► Suitable for multiple PCB Reflow

► Good Immersion

► Storage: Keep refrigerated

► Notice: This item has no Ag and Tin in it.

Specification:

Material: Plastic+Solder paste

Package:

1 x 100G