RL-044 OT2 BGA IC Reballing Stencil

Relife RL-044 OT2 BGA IC Reballing Stencil For Android Nand Flash EMMC EMCP UFS LPDDR PCIE BGA162 BGA153 BGA169 BGA221 BGA186 BGA297 BGA254 BGA178 BGA200 BGA110 BGA60 BGA70 similar EMMC:1 EMMC:2 EMMC:3

• Relife RL-044 OT2 BGA IC Reballing Stencil
• For Android Nand Flash EMMC EMCP UFS LPDDR PCIE
• Compatible with various BGA types: BGA162, BGA153, BGA169, BGA221
• Ideal for soldering and reballing applications
• Essential tool for fastening, gluing, and soldering tasks

This BGA IC Reballing Stencil is perfect for Android Nand Flash EMMC EMCP UFS LPDDR PCIE BGA162 BGA153 BGA169 BGA221 BGA186 BGA297 BGA254 BGA178 BGA200 BGA110 BGA60 BGA70 and similar EMMC:1 EMMC:2. It is a must-have tool for anyone who works with electronics and needs to reball ICs. The stencil is made of high-quality materials and is designed to be durable and long-lasting. With this stencil, you can easily reball your ICs and ensure that they are working properly. Whether you are a professional or a DIY enthusiast, this BGA IC Reballing Stencil is the perfect tool for you.