Mechanic high activity Solder flux 559 [100G]
600.00৳
Mechanic high activity Solder flux 559 [100G] is a no-clean solder paste made from a blend of high-purity, non-recycled tin, silver and copper metal powder mixed with a no-clean flux. This halogen-free and lead-free solder paste is designed for extreme flux activity and the enhanced printing requirements of ultra-fine pitch applications. It provides excellent wetting on copper OSP-coatings. Wide reflow process windows combined with high thermal stability yield solder joints with smooth surfaces.
Mechanic high activity Solder flux 559 is the best lead-free solder paste for facilitating high speed printing. It can yield brick-like prints even when using ultra-fine pitch stencils as small as 0.3 mm.
The BGA Solder Paste is a high viscosity no-clean flux, it can be used for PCB, SMD, reworking, it can be used for soldering and reballing of computer and phone chips BGA Soldering Paste Flux is the mixture of high-quality alloyed powder and resinic pasty flux , it can avoid the pale yellow residue, so you are easy to clean the board. Soldering paste for cell phone PCB and SMD, electronics welding, soldering and etc. Help to repair the circuit boards and protect the electronic components A necessary material for repairing the mobile phone mainboard Package include: 1 x Soldering Paste Flux
User Reviews
Be the first to review “Mechanic high activity Solder flux 559 [100G]”
Related Products
![Mechanic high activity Solder flux 559 [100G]](https://masudtel.com/wp-content/uploads/thumbs_dir/100g-flax-559-qvujyeessnaag77hx0wi5kkm0stlpnkvptiv3pupn0.jpg)
There are no reviews yet.