SU2 BGA Reballing Stencil for SC6531E SC9850 SC6820 SC9820A SC6500D SC6533G SC6531DA SC7731 Spreadtrum SC Chip IC

SU2 SPREADTRUM CPU stencil SC9850/6820/9820A/651E/6531DA/6500D/6533G IC Reballing Solder Tin Plant Steel Net 0.12mm SU:2

Stencil Purpose: Stencils are used to precisely apply solder paste to solder pads on a PCB. This solder paste serves as a temporary adhesive that holds surface-mount components (SMDs) in place during the soldering process.

Reballing: Stencils are also commonly used in reballing processes, which involve removing and then re-soldering a component, such as a BGA (Ball Grid Array) chip. The stencil helps apply solder balls to the component’s pads with precision.

Compatible Devices: The stencil is likely designed for use with specific models. Each stencil is typically designed to match the component layout of a particular device or series.

Aperture Design: The stencil features a pattern of tiny apertures (holes) that align with the solder pads on the PCB or component. When solder paste is applied over the stencil and pushed through these apertures, it deposits a controlled amount of solder onto the pads.

Stencil Material: Stencils are commonly made from stainless steel or other durable materials to withstand repeated use and exposure to high-temperature soldering processes.

SUPORTED MODEL SU2 SPREADTRUM CPU stencil:

SC6531E5

SC9850

SC6820

SC9820A

SC6500D

SC6533G

SC6531DA

SC7731E

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